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| STTH110 High voltage ultrafast rectifier Features Low forward voltage drop High reliability High surge current capability Soft switching for reduced EMI disturbances Planar technology K K DO-41 STTH110 SMA (JEDEC DO-214AC) STTH110A A A Description The STTH110, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. Table 1. Device summary Symbol IF(AV) VRRM Tj (max) VF(max) Value 1A 1000 V 175 C 1.42 V October 2009 Doc ID 9344 Rev 2 1/6 www.st.com 6 Characteristics STTH110 1 Characteristics Table 2. Symbol VRRM V(RMS) IF(AV) Absolute ratings (limiting values) Parameter Repetitive peak reverse voltage Voltage rms SMA Average forward current DO-41 Forward Surge current t = 8.3 ms Storage temperature range Maximum operating junction temperature TL = 110 C = 0.5 TL = 125 C = 0.5 SMA DO-41 Value 1000 700 1 A 1 Unit V V 18 A 20 -50 to + 175 175 C C IFSM Tstg Tj Table 3. Symbol Rth(j-l) Rth(j-a) Thermal resistance Parameter SMA Junction to lead Lead length = 10 mm Junction to ambient Lead length = 10 mm DO-41 DO-41 45 110 C/W Value 30 Unit Table 4. Symbol IR Static Electrical Characteristics Parameter Reverse leakage current Forward voltage drop Tests conditions Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C VR = 1000 V Min. Typ. Max. 10 A 50 1.7 IF = 1 A V 0.98 1.42 Unit VF To evaluate the conduction losses use the following equation: P = 1.20 x IF(AV) + 0.225 IF2(RMS) Table 5. Symbol trr Dynamic electrical characteristics Parameter Reverse recovery time Forward recovery time Forward recovery voltage Tj = 25 C Tests conditions Tj = 25 C IF = 0.5, A Irr = 0.25 A, IR = 1 A IF = 1 A, dIF/dt = 50 A/ms VFR = 1.1 x VFmax Min. Typ. Max. 75 Unit ns tfr VFP 300 18 ns V 2/6 Doc ID 9344 Rev 2 STTH110 Characteristics Figure 1. P(W) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.1 0.2 Conduction losses versus average Figure 2. current IFM(A) 100.0 Forward voltage drop versus forward current = 0.05 = 0.1 = 0.2 = 0.5 Tj=150C (maximum values) =1 10.0 Tj=150C (typical values) Tj=25C (maximum values) 1.0 T IF(AV)(A) 0.3 0.4 0.5 0.6 0.7 0.8 =tp/T 0.9 1.0 tp 0.1 1.1 1.2 0.0 0.5 1.0 1.5 VFM(V) 2.0 2.5 3.0 3.5 4.0 4.5 Figure 3. Relative variation of thermal Figure 4. impedance junction ambient versus pulse duration (DO-41) 1.0 Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4) (SMA) Zth(j-c)/Rth(j-c) 1.0 epoxy FR4, leads = 10 mm 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-01 1.E+00 1.E+01 = 0.2 = 0.1 Single pulse = 0.5 Zth(j-c)/Rth(j-c) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 = 0.2 = 0.1 = 0.5 T 0.2 0.1 T tp(s) =tp/T 1.E+02 tp 0.0 1.E+03 Single pulse tp(s) 1.E+00 1.E+01 =tp/T 1.E+02 tp 1.E+03 1.E-01 Figure 5. Thermal resistance junction to ambient versus copper surface under each lead (DO-41) epoxy printed circuit board FR4, copper thickness: 35 m Figure 6. Thermal resistance junction to ambient versus copper surface under each lead (SMA). epoxy printed circuit board FR4, copper thickness: 35 m Rth(j-a)(C/W) 120 110 100 90 80 70 60 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 9 10 140 130 120 110 100 90 80 70 60 50 40 30 20 Rth(j-a)(C/W) S(cm) 10 0 0.0 0.5 1.0 1.5 2.0 S(cm) 2.5 3.0 3.5 4.0 4.5 5.0 Doc ID 9344 Rev 2 3/6 Package information STTH110 2 Package information Epoxy meets UL 94, V0 Band indicates cathode Bending method (DO-41): see Application note AN1471 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 6. SMA dimensions Dimensions E1 Ref. Millimeters Min. Max. 2.45 0.20 1.65 0.40 2.90 5.35 4.60 1.50 Inches Min. 0.075 0.002 0.049 0.006 0.089 0.189 0.156 0.030 Max. 0.094 0.008 0.065 0.016 0.114 0.211 0.181 0.059 D A1 A2 b 1.90 0.05 1.25 0.15 2.25 4.80 3.95 0.75 E c A1 D E E1 L C L A2 b Figure 7. Footprint (dimensions in mm) 1.4 2.63 1.4 1.64 5.43 Table 7. DO-41 (plastic) package dimensions Dimensions Ref. OD OB Millimeters Min. Max. 5.20 2.71 Inches Min. 0.160 0.080 1 Max. 0.205 0.107 A B C A C 4.07 2.04 25.4 0.71 C D 0.86 0.028 0.034 4/6 Doc ID 9344 Rev 2 STTH110 Ordering information 3 Ordering information Table 8. Ordering information Marking STTH110 H10 STTH110 Package DO-41 SMA DO-41 Weight 0.34 g 0.068 g 0.34 g Base qty 2000 5000 5000 Delivery mode Ammopack Tape and reel Tape and reel Order code STTH110 STTH110A STTH110RL 4 Revision history Table 9. Date Jan-2003 30-Sept-2009 Document revision history Revision 1 2 Last update. Updated table 7 package dimensions. Changes Doc ID 9344 Rev 2 5/6 STTH110 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 6/6 Doc ID 9344 Rev 2 |
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